WorldCat Identities

Suga, Tadatomo 1953-

Overview
Works: 18 works in 32 publications in 3 languages and 600 library holdings
Genres: Conference papers and proceedings 
Roles: Editor, Author, Other
Classifications: TA401.3, 660
Publication Timeline
.
Most widely held works by Tadatomo Suga
2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration : proceedings of 2012 3rd IEEE Workshop on Low Temperature Bonding for 3D Integration (LTB-3D 2012), May 22-23, 2012, the University of Tokyo, YAYOI Auditorium, Tokyo, Japan by IEEE International Workshop on Low Temperature Bonding for 3D Integration( )

1 edition published in 2012 in English and held by 236 WorldCat member libraries worldwide

Bruchmechanische Charakterisierung und Bestimmung der Haftfestigkeit von Materialübergängen by Tadatomo Suga( Book )

4 editions published in 1983 in German and held by 29 WorldCat member libraries worldwide

Metal-ceramic joints : June 2-June 3, 1988, Sunshine City, Ikebukuro, Tokyo, Japan by MRS International Meeting on Advanced Materials( Book )

3 editions published in 1989 in English and held by 24 WorldCat member libraries worldwide

2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) 15-16 July 2014, Tokyo, Japan( )

1 edition published in 2014 in English and held by 17 WorldCat member libraries worldwide

Annotation, This workshop will focus on low temperature bonding technologies which will ultimately lead to entirely new manufacturing approaches to 3D and heterogeneous integration of semiconductor devices and microsystems, as well as photonic systemsThe workshop invites papers that document new developments in low temperature bonding technologies, new device applications, facilities and technologies for mass production, and basic science relating to these technologiesTheir impact on the paradigm shift in the semiconductor industry along with 3D integration technologies is also of interest
2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) 22-23 May 2012, Tokyo, Japan( )

1 edition published in 2012 in English and held by 16 WorldCat member libraries worldwide

Semiconductor wafer bonding 10 : science, technology, and applications. by International Symposium on Semiconductor Wafer Bonding( Book )

3 editions published in 2008 in English and held by 6 WorldCat member libraries worldwide

3-jigen shisutemu in pakkēji to zairyō gijutsu = 3D-SiP Technologies and Materials( Book )

3 editions published between 2007 and 2012 in Japanese and held by 4 WorldCat member libraries worldwide

Namari furī handa gijutsu by Tadatomo Suga( Book )

2 editions published in 1999 in Japanese and held by 3 WorldCat member libraries worldwide

Erekutoronikusu eko dezain : Jissō no shōrai by Tadatomo Suga( Book )

2 editions published in 2002 in Japanese and held by 3 WorldCat member libraries worldwide

Proceedings of the MRS International Meeting on Advanced Materials by MRS International Meeting on Advanced Materials( Book )

1 edition published in 1989 in English and held by 3 WorldCat member libraries worldwide

Low temperature Cu-Cu bonding by transient liquid phase sintering of mixed Cu nanoparticles and Sn-Bi eutectic powders by M Khairi Faiz( )

1 edition published in 2017 in English and held by 2 WorldCat member libraries worldwide

Seramikkusu setsugō kōgaku( Book )

2 editions published in 1990 in Japanese and held by 2 WorldCat member libraries worldwide

2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D 2014) Tokyo, Japan, 15-16 July 2014( Book )

1 edition published in 2014 in English and held by 1 WorldCat member library worldwide

2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D 2012) Tokyo, Japan, 22-23 May 2012( Book )

1 edition published in 2012 in English and held by 1 WorldCat member library worldwide

Kōdōkanki jutsugi shōkai by Tōko Fujita( Book )

1 edition published in 1936 in Japanese and held by 1 WorldCat member library worldwide

Fast atom bombardment onto vertically aligned multi-walled carbon nanotube bumps to achieve low interconnect resistance with Au layer( )

1 edition published in 2015 in English and held by 1 WorldCat member library worldwide

 
moreShow More Titles
fewerShow Fewer Titles
Audience Level
0
Audience Level
1
  General Special  
Audience level: 0.00 (from 0.00 for 2012 3rd I ... to 0.00 for 2012 3rd I ...)

Alternative Names
Suga, Tadatomo

Suga, Tadatomo 1953-

スガ, タダトモ

スガ, タダトモ 1953-

須賀唯知 1953-

Languages
English (18)

Japanese (10)

German (4)