WorldCat Identities

CMP (Firm)

Overview
Works: 42 works in 50 publications in 1 language and 1,918 library holdings
Genres: Conference papers and proceedings 
Roles: Sponsor
Classifications: TK7870.25, 621.381
Publication Timeline
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Most widely held works by CMP (Firm)
Collection of papers presented at the 14th International Workshop on Thermal Investigation of ICs and Systems : Rome, Italy, 24-26 September 2008 by International Workshop on Thermal Investigations of ICs and Microstructures( )

3 editions published in 2008 in English and held by 229 WorldCat member libraries worldwide

DTIP 2010 : Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS : Seville, Spain, 5-7 May 2010 by Test, Integration, and Packaging of MEMS/MOEMS Symposium on Design( )

1 edition published in 2010 in English and held by 220 WorldCat member libraries worldwide

Collection of papers presented at the 13th International Workshop on THERMal INvestigation of ICs and Systems : Budapest, Hungary 17-19 September 2007 by International Workshop on Thermal Investigations of ICs and Microstructures( )

1 edition published in 2007 in English and held by 219 WorldCat member libraries worldwide

THERMINIC 2009 : international workshop on THERMal INvestigation of ICs and Systems : 7-9 October 2009, Leuven, Belgium by International Workshop on Thermal Investigations of ICs and Microstructures( )

1 edition published in 2009 in English and held by 195 WorldCat member libraries worldwide

Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 2013 Symposium on : 16-18 April 2013 : Barcelona, Spain by Test, Integration, and Packaging of MEMS/MOEMS Symposium on Design( )

1 edition published in 2013 in English and held by 192 WorldCat member libraries worldwide

DTIP 2014 : Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS : Cannes, France, 1-14 April 2014 by Test, Integration, and Packaging of MEMS/MOEMS Symposium on Design( )

1 edition published in 2014 in English and held by 186 WorldCat member libraries worldwide

Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS (DTIP) : Budapest, Hungary, May, 30th-June, 2nd, 2016 by Test, Integration, and Packaging of MEMS/MOEMS Symposium on Design( )

1 edition published in 2016 in English and held by 185 WorldCat member libraries worldwide

Annotation
Collection of papers presented at the ... International Workshop on THERMal INvestigation of ICs and Systems by International Workshop on Thermal Investigations of ICs and Microstructures( )

in English and held by 163 WorldCat member libraries worldwide

Collection of papers presented at the Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS : Montpellier, France, 27-30 April 2015 by Test, Integration, and Packaging of MEMS/MOEMS Symposium on Design( )

1 edition published in 2015 in English and held by 92 WorldCat member libraries worldwide

Annotation
THERMINIC 2009 : 15th International Workshop on Thermal Investigations of ICs and Systems : 7-9 October 2009, Leuven, Belgium by International Workshop on Thermal Investigations of ICs and Microstructures( )

1 edition published in 2010 in English and held by 28 WorldCat member libraries worldwide

DTIP of MEMS & MOEMSv2009 : 1-3 April, Rome, Italy by Test, Integration, and Packaging of MEMS/MOEMS Symposium on Design( )

1 edition published in 2009 in English and held by 28 WorldCat member libraries worldwide

13th International Workshop on Thermal Investigation of ICs and Systems, 2007 THERMINIC 2007 ; 17-19 Sept. 2007, Budapest, Hungary( )

1 edition published in 2007 in English and held by 12 WorldCat member libraries worldwide

14th International Workshop on Thermal Investigation of ICs and Systems THERMINIC ; 24-26 Sept. 2008, Rome, Italy( )

1 edition published in 2008 in English and held by 12 WorldCat member libraries worldwide

2015 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) 27-30 April 2015, Montpellier, France( )

1 edition published in 2015 in English and held by 11 WorldCat member libraries worldwide

Annotation, The goal of the Symposium is to provide a forum for in depth investigations and interdisciplinary discussions involving design, modeling, testing, micromachining, microfabrication, integration and packaging of structures, devices, and systems
15th International Workshop on Thermal Investigations of ICs and Systems, 2009 THERMINIC 2009 ; Leuven, Belgium, 7-9 October 2009( )

1 edition published in 2009 in English and held by 11 WorldCat member libraries worldwide

Symposium on design, test, integration and packaging of MEMS-MOEMS : DTIP 2011( )

1 edition published in 2010 in English and held by 11 WorldCat member libraries worldwide

 
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Audience Level
0
Audience Level
1
  Kids General Special  
Audience level: 0.54 (from 0.47 for DTIP 2014 ... to 0.90 for MEMS/MOEMS ...)

Alternative Names
Circuits multi-projets (Firm)

CMP

Multi-Project Circuits

Multi-Project Circuits (Firm)

Languages
English (28)