WorldCat Identities

IEEE Electronics Packaging Society

Overview
Works: 29 works in 31 publications in 1 language and 1,788 library holdings
Genres: Conference papers and proceedings 
Roles: Sponsor
Classifications: TK7801,
Publication Timeline
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Most widely held works by IEEE Electronics Packaging Society
2017 IEEE CPMT Symposium Japan (ICSJ) November 20-22, 2017 : Kyoto University Clock Tower Centennial Hall, Kyoto, Japan by IEEE CPMT Symposium Japan( )

2 editions published in 2017 in English and held by 194 WorldCat member libraries worldwide

This year s Symposium will mainly focus on packaging technologies for Fan Out technologies, optoelectronics, RF high speed electronics, bioelectronics and other topics of primary interest to the participants Bring your latest research results and share with the participants who are experts from the industry and the academia, and discuss with them Anybody contributing to the achievement of a sustainable society through electronics is very welcome at this symposium
IMPACT 2017 : International Microsystems, Packaging, Assembly and Circuits Technology Conference : proceedings : October 25 (Wed) - 27 (Fri), 2017, Taipei Nangang Exhibition Center by Packaging, Assembly, and Circuits Technology Conference International Microsystems( )

1 edition published in 2017 in English and held by 180 WorldCat member libraries worldwide

2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) by EuroSimE( )

1 edition published in 2019 in English and held by 144 WorldCat member libraries worldwide

13th International Congress Molded Interconnect Devices : scientific proceedings : September 25th-26th, 2018, Würzburg, Germany by International Congress Molded Interconnect Devices( )

1 edition published in 2018 in English and held by 141 WorldCat member libraries worldwide

3D-PEIM : International Symposium on 3D Power Electronics Integration and Manufacturing : June 25-27, 2018, College Park, MD by International Symposium on 3D Power Electronics Integration and Manufacturing( )

2 editions published in 2018 in English and held by 141 WorldCat member libraries worldwide

2018 XXIIIrd International Seminar/Workshop on Direct and Inverse Problems of Electromagnetic and Acoustic Wave Theory (DIPED) : proceedings : Tbilisi, September 24-27, 2018 by International Seminar/Workshop on Direct and Inverse Problems of Electromagnetic and Acoustic Wave Theory( )

1 edition published in 2018 in English and held by 140 WorldCat member libraries worldwide

Di shi ba jie dian zi feng zhuang ji shu guo ji hui yi = the 19th International Conference on Electronic Packaging Technology : August 8-11, Shanghai, China by International Conference on Electronic Packaging Technology( )

1 edition published in 2018 in English and held by 140 WorldCat member libraries worldwide

IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS 2018) : Hotel TAJ, Chandigarh by Electrical Design of Advanced Packaging and Systems Symposium( )

1 edition published in 2018 in English and held by 135 WorldCat member libraries worldwide

2018 7th Electronic System-Integration Technology Conference (ESTC) : Sept. 18th to 21st, 2018, Dresden, Germany by Electronics Systemintegration Technology Conference( )

1 edition published in 2018 in English and held by 130 WorldCat member libraries worldwide

Proceedings of the Seventeenth InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems : ITherm 2018 : May 29 - June 1, 2018, San Diego, CA USA by InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems( )

1 edition published in 2018 in English and held by 91 WorldCat member libraries worldwide

2018 IEEE CPMT Symposium Japan (ICSJ) : November 19-21, 2018, Kyoto University Clock Tower Centennial Hall, Kyoto, Japan by IEEE CPMT Symposium Japan( )

1 edition published in 2018 in English and held by 89 WorldCat member libraries worldwide

2018 IEEE 22nd Workshop on Signal and Power Integrity (SPI) : proceedings : 22-25 May, 2018, Brest, France by IEEE Workshop on Signal and Power Integrity( )

1 edition published in 2018 in English and held by 88 WorldCat member libraries worldwide

2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition : 10-13 Sept. 2017 by European Microelectronics and Packaging Conference( )

1 edition published in 2017 in English and held by 14 WorldCat member libraries worldwide

EMAP 2018 : 2018 20th International Conference on Electronic Materials and Packaging (17-20 December, 2018) by International Symposium on Electronic Materials and Packaging( )

1 edition published in 2018 in English and held by 13 WorldCat member libraries worldwide

2019 8th International Workshop on Advances in Sensors and Interfaces (IWASI) : proceedings : June 13-14, 2019, Otranto, Italy by IEEE International Workshop on Advances in Sensors and Interfaces( )

1 edition published in 2019 in English and held by 12 WorldCat member libraries worldwide

Intelligent everything proceedings : October 25 (Wed)-27 (Fri) 2017, Taipei Nangang Exhibition Center by Packaging, Assembly and Circuits Technology Conference International Microsystems( )

1 edition published in 2017 in English and held by 10 WorldCat member libraries worldwide

2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) 6-9 Dec. 2017 by Electronics Packaging Technology Conference( )

1 edition published in 2017 in English and held by 10 WorldCat member libraries worldwide

EPEPS 2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging and Systems : October 14-17, 2018, San Jose Marriott, San Jose, California by IEEE Conference on Electrical Performance of Electronic Packaging and Systems( )

1 edition published in 2018 in English and held by 9 WorldCat member libraries worldwide

IEEE 68th Electronic Components and Technology Conference ECTC 2018 : 29 May-1 June 2018, San Diego, California : proceedings by IEEE Electronic Components and Technology Conference( )

1 edition published in 2018 in English and held by 9 WorldCat member libraries worldwide

2019 IEEE International Workshop on Integrated Power Packaging (IWIPP)( )

1 edition published in 2019 in Undetermined and held by 3 WorldCat member libraries worldwide

 
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Audience Level
0
Audience Level
1
  Kids General Special  
Audience level: 0.49 (from 0.44 for 2018 7th E ... to 0.89 for 2017 IEEE ...)

Alternative Names
Electronics Packaging Society (formerly Components, Packaging, and Manufacturing Technology Society) of the Institute of Electrical and Electronics Engineers, Inc.

EPS

IEEE EPS

Institute of Electrical and Electronics Engineers Electronics Packaging Society

Languages
English (21)