沢田廉士

Guang wei ji dian xi tong by Renshi Sawada( Book )

1 edition published in 2005 in Chinese and held by 32 WorldCat member libraries worldwide

Hikari maikuromashin( Book )

2 editions published in 2002 in Japanese and held by 4 WorldCat member libraries worldwide

MEMS NEMS no saisentan gijutsu to ōyō tenkai = Advanced technologies and applications of MEMS/NEMS( Book )

2 editions published in 2006 in Japanese and held by 2 WorldCat member libraries worldwide

Characteristics of a monolithically integrated micro-displacement sensor( )

1 edition published in 2011 in English and held by 2 WorldCat member libraries worldwide

Simulation and fabrication of a MEMS optical scanner device considering deformation caused by internal stress( )

1 edition published in 2016 in English and held by 1 WorldCat member library worldwide

Abstract: We fabricated a MEMS actuator device that is used as an actuator component of an optical scanning device without deflection of the device using finite element method (FEM) software. When Pt/Ti/PZT/Pt/Ti/SiO2 multilayers were deposited on a silicon-on-insulator (SOI) wafer in order to fabricate the MEMS actuator device, the wafer was deflected because of inner stress generated by thin-film deposition, and as a result, the MEMS actuator device using the deflected wafer was also deflected. We aimed to define the relationship between the deflection of the SOI wafer and the deflection of the MEMS actuator device by simulation. Moreover, by using this relationship, we determined the optimal deflection of the SOI wafer after the deposition of thin films, enabling the fabrication of a MEMS actuator device without deflection, by simulation. From the simulation result, when the changes in the deflection of SOI wafers were 14.1 and 7.4 µm, the displacements of the MEMS actuator device were 1.1 and 5.7 µm, respectively. The simulation results were in good agreement with the experimental results. From the simulation results, the optimal wafer deflection for preventing the deflection of the MEMS actuator device was 15.6 µm. This value was close to the experimental value, 14.1 µm. This method enables easy simulation of any MEMS device that is complicated in design and which uses multilayer thin films

Microelectromagnetic actuator based on a 3D printing process for fiber scanner application( )

1 edition published in 2015 in English and held by 1 WorldCat member library worldwide